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Die Saw

Unity 3D, Blender

September 2022 - May 2023

Developer, Lead Modeler

Team Size 4

Die Saw

The "Die Saw" invites you experience semiconductor fabrication with an unparalleled training experience. Immerse yourself in precision dicing as you engage with a digital twin of a state-of-the-art Die saw. This simulation isn't just about following instructions; it's about learning through a hands-on, mistake-friendly environment that replicates the challenges and nuances of real-world fabrication.

In this free-form training experience, you'll have the opportunity to dice a silicon wafer, encountering the trials and tribulations that come with mastering this process. Experiment and learn as you encounter and rectify natural mistakes, gaining invaluable insights that will set you on the path to becoming an expert in silicon wafer dicing.

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